【轉知】[ISSP2026] Abstract Submission Due Dec 26, 2025

2025/11/13

Dear colleagues,
I hope this message finds you well.
We would like to draw your attention to the upcoming abstract submission deadline for
the 18th International Symposium on Sputtering and Plasma Processes (ISSP2026),
to be held in Kyoto, Japan.

Event: ISSP2026 – The 18th International Symposium on Sputtering & Plasma Processes
Dates: June 30 – July 3, 2026
Venue: Kyoto Research Park, Kyoto, Japan
Website: https://www.issp-jvss.org
Abstract Submission Deadline: December 26, 2025

Since its inception in 1991, ISSP has been held biennially to foster discussions and exchange of information
across academia and industry in the field of sputtering and plasma processes.
ISSP2026 will be held under the theme “Advancement in Sputtering & Plasma Processes for a Connected Future,”
featuring distinguished invited speakers from around the world.

<Invited Speakers (selected)>
Gregory Abadias (Université de Poitiers, France)
Andre Anders (Plasma Engineering LLC, United States)
Ralf Bandorf (Fraunhofer IST, Germany)
Elizabeth von Hauff (Fraunhofer FEP, Germany)
Mati Horprathum (NECTEC, Thailand)
Ching-Lien Hsiao (Linköping University, Sweden)
Nobuhiko P. Kobayashi (University of California Santa Cruz, United States)
Paul H. Mayrhofer (TU Wien, Austria)
Martin Rudolph (Leibniz Institute of Surface Engineering, Germany)
Jón Tómas Guðmundsson (University of Iceland, Iceland)
Fan-Bean Wu (National United University, Taiwan)

<Special Tutorial>  
“Coating materials design”  
by Prof. Jochen M. Schneider (RWTH Aachen University)
For more details, please visit the official website:
https://www.issp-jvss.org

We look forward to welcoming you to Kyoto in 2026.
Please feel free to share this information with your colleagues.

ISSP2026, Conference Chair
Junichi NOMOTO