Dear colleagues,

We would like to remind you that the abstract submission deadline for ISSP2024 is reaching in 1 week.
The papers presented at the ISSP2024 will be submitted to a special issue of JVSTB!
We are looking forward to receiving many abstract submissions!

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Event: The 17th International Symposium on Sputtering & Plasma processes (ISSP2024)
Location: Kyoto Research Park, Kyoto, Japan (https://www.krp.co.jp/english/access_to_krp/)
Web: https://www.issp-jvss.org/
Abstract submission deadline: February 29, 2024
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<Invited speakers>
Takeshi Nogami (IBM Research/IBM Corp., United States)
Jochen Schneider (RWTH, Aachen University, Germany)
Mauricio Terrones (The Pennsylvania State University, United States)
Takeshi Yanagida (University of Tokyo / Kyushu University, Japan)
Stephane Lucas (University of Namur, Belgium)
Jinn P. Chu (National Taiwan University of Science and Technology, Taiwan)
Grzegorz Greczynski (Linköping University, Sweden)
Jyh-Wei Lee (Ming Chi University of Technology, Taiwan)
Jirí Houška (University of West Bohemia, Czech Republic)
Seung Hoon Lee (Korea Institute of Materials Science, KIMS, Korea)
Wan-Yu Wu (National United University, Taiwan)
Hyeong-U Kim (Korea Institute of Machinery & Materials, KIMM, Korea)

<Special tutorial>
Introduction to High-Power Impulse Magnetron Sputtering
by Prof. Daniel Lundin (Linköping University,Sweden)

<Industrial presenters>
Cemecon, Alexander Marxer
Gencoa, Dermot Monaghan
Impedans, Thomas Gilmore
Ionautics, Johan Bohlmark
Nano4Energy, Ivan Fernandez
Oerlikon Surface Solutions, Christian Scholz
PLASUS GmbH, Thomas Schütte
TRUMPF Huttinger, Anna W. Oniszczuk